Kinsus Interconnect Technology Corp.

Taiwan's semiconductor industry not only possesses the core advantages of talent and technology, but also the most important thing is to build a complete industrial supply chain. With the recent trend of IC packaging gradually being replaced by BGA, CSP, and even Flip-Chip as the mainstream of packaging, Kinsus’ investment on the R&D and manufacturing technology of IC carrier and total package technology solution have become the leading edge in technology, which includes technologies such as fine lines, thin thickness, and complex structures, etc., which, combined with the keen sensitivity to the development of the market and its needs, have gradually formed the overall leading edge of the industry.