oak-mitsui technologies

Oak-Mitsui was incorporated in 1976 as a joint venture between Oak-Industries, Mitsui Mining and Smelting of Japan, and Anaconda. It was one of only three major companies in the US manufacturing ultrathin copper foil for use in the printed circuit industry. The original process was developed by Anaconda in the United States and then perfected by Mitsui in Ageo, Japan. The Hoosick Falls based company first began copper foil production in 1977 and within one year expanded to double its capacity. In May 1986, Allied Signal acquired Oak Materials Group which Oak-Mitsui was a part. It then became a joint venture between Allied Signal and Mitsui Mining and Smelting of Japan. In 1999, Oak-Mitsui acquired the technology for ultrasonically bonding copper foil to thin aluminum separator sheets. This technology was used to start the lamination products division ABC, Aluminum Bonded Copper. Over the past several years, this business has grown to be a leader in the supply of outer layer copper foil to the printed circuit board industry in the US and Asia. In 2000 Oak-Mitsui became a wholly owned subsidiary of Mitsui Kinzoku, the World leader in Electrodeposited Copper foil. In 2003, Mitsui Kinzoku announced the creation of Oak-Mitsui Technologies. This new company was organized to investigate and develop new processes and products for the electronics industry. Development efforts here are an extension of ongoing R & D initiatives at Mitsui Kinzokus Central Laboratories in Ageo, Japan. In 2004, Mitsui Kinzoku announced the expansion of Oak-Mitsui Technologies R & D activities to include the development of new base foils for the global electronics industry. Development efforts continue in the previously idled Hoosick Falls facility since it's re-commissioning in April 2005. Hoosick Falls is the Headquarters of Oak-Mitsui Technologies and is also the manufacturing site of the FaradFlex® line of Buried Capacitance products.