Companies Directory

STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device. STATS ChipPAC is wholly owned by Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). As the third largest OSAT in the world, the JCET Group of companies offer customers a comprehensive and broad product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), Through Silicon Via (TSV) and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea and customer support offices throughout Asia, the United States and Europe. The JCET Group of companies includes Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP), also wholly owned by JCET. JCAP is the largest wafer bump and Wafer Level Chip Scale Packaging (WLCSP) provider in China with a broad set of capabilities including advanced wafer bump technology (copper pillar, gold and solder), wafer probe, WLCSP, Radio Frequency Identification (RFID), Encapsulated Chip Package (ECP) and Through Silicon Via (TSV) technology. JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. For more information, visit www.jcetglobal.com.

STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device. STATS ChipPAC is wholly owned by Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). As the third largest OSAT in the world, the JCET Group of companies offer customers a comprehensive and broad product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), Through Silicon Via (TSV) and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea and customer support offices throughout Asia, the United States and Europe. The JCET Group of companies includes Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP), also wholly owned by JCET. JCAP is the largest wafer bump and Wafer Level Chip Scale Packaging (WLCSP) provider in China with a broad set of capabilities including advanced wafer bump technology (copper pillar, gold and solder), wafer probe, WLCSP, Radio Frequency Identification (RFID), Encapsulated Chip Package (ECP) and Through Silicon Via (TSV) technology. JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. For more information, visit www.jcetglobal.com.

STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device. STATS ChipPAC is wholly owned by Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). As the third largest OSAT in the world, the JCET Group of companies offer customers a comprehensive and broad product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), Through Silicon Via (TSV) and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea and customer support offices throughout Asia, the United States and Europe. The JCET Group of companies includes Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP), also wholly owned by JCET. JCAP is the largest wafer bump and Wafer Level Chip Scale Packaging (WLCSP) provider in China with a broad set of capabilities including advanced wafer bump technology (copper pillar, gold and solder), wafer probe, WLCSP, Radio Frequency Identification (RFID), Encapsulated Chip Package (ECP) and Through Silicon Via (TSV) technology. JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. For more information, visit www.jcetglobal.com.

STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device. STATS ChipPAC is wholly owned by Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). As the third largest OSAT in the world, the JCET Group of companies offer customers a comprehensive and broad product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), Through Silicon Via (TSV) and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea and customer support offices throughout Asia, the United States and Europe. The JCET Group of companies includes Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP), also wholly owned by JCET. JCAP is the largest wafer bump and Wafer Level Chip Scale Packaging (WLCSP) provider in China with a broad set of capabilities including advanced wafer bump technology (copper pillar, gold and solder), wafer probe, WLCSP, Radio Frequency Identification (RFID), Encapsulated Chip Package (ECP) and Through Silicon Via (TSV) technology. JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. For more information, visit www.jcetglobal.com.

STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device. STATS ChipPAC is wholly owned by Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). As the third largest OSAT in the world, the JCET Group of companies offer customers a comprehensive and broad product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), Through Silicon Via (TSV) and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea and customer support offices throughout Asia, the United States and Europe. The JCET Group of companies includes Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP), also wholly owned by JCET. JCAP is the largest wafer bump and Wafer Level Chip Scale Packaging (WLCSP) provider in China with a broad set of capabilities including advanced wafer bump technology (copper pillar, gold and solder), wafer probe, WLCSP, Radio Frequency Identification (RFID), Encapsulated Chip Package (ECP) and Through Silicon Via (TSV) technology. JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. For more information, visit www.jcetglobal.com.

STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device. STATS ChipPAC is wholly owned by Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). As the third largest OSAT in the world, the JCET Group of companies offer customers a comprehensive and broad product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), Through Silicon Via (TSV) and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea and customer support offices throughout Asia, the United States and Europe. The JCET Group of companies includes Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP), also wholly owned by JCET. JCAP is the largest wafer bump and Wafer Level Chip Scale Packaging (WLCSP) provider in China with a broad set of capabilities including advanced wafer bump technology (copper pillar, gold and solder), wafer probe, WLCSP, Radio Frequency Identification (RFID), Encapsulated Chip Package (ECP) and Through Silicon Via (TSV) technology. JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. For more information, visit www.jcetglobal.com.

STATSCORE is a unique organization that provides 𝗶𝗻-𝗵𝗼𝘂𝘀𝗲 𝗰𝗼𝗹𝗹𝗲𝗰𝘁𝗲𝗱 𝘀𝗽𝗼𝗿𝘁𝘀 𝗹𝗶𝘃𝗲 𝘀𝗰𝗼𝗿𝗲𝘀 𝗮𝗻𝗱 𝘀𝘁𝗮𝘁𝘀 𝗳𝗼𝗿 𝟯𝟬+ 𝗱𝗶𝘀𝗰𝗶𝗽𝗹𝗶𝗻𝗲𝘀 and 𝗲𝘆𝗲-𝗰𝗮𝘁𝗰𝗵𝗶𝗻𝗴 𝗳𝗿𝗼𝗻𝘁-𝗲𝗻𝗱 𝗽𝗿𝗼𝗱𝘂𝗰𝘁𝘀 for 𝗼𝗻𝗹𝗶𝗻𝗲 𝗯𝗼𝗼𝗸𝗺𝗮𝗸𝗲𝗿𝘀, 𝘀𝗽𝗼𝗿𝘁𝘀 𝗼𝗿𝗴𝗮𝗻𝗶𝘇𝗮𝘁𝗶𝗼𝗻𝘀, and 𝗺𝗲𝗱𝗶𝗮 𝘄𝗲𝗯𝘀𝗶𝘁𝗲𝘀. Our sports widgets have 𝗵𝘂𝗻𝗱𝗿𝗲𝗱𝘀 𝗼𝗳 𝗺𝗶𝗹𝗹𝗶𝗼𝗻𝘀 𝗼𝗳 𝘃𝗶𝗲𝘄𝘀 𝗽𝗲𝗿 𝗺𝗼𝗻𝘁𝗵 all over the world 𝘄𝗶𝗻𝗻𝗶𝗻𝗴 𝗺𝗼𝗿𝗲 𝘂𝘀𝗲𝗿𝘀 𝗳𝗼𝗿 𝗼𝘂𝗿 𝗽𝗮𝗿𝘁𝗻𝗲𝗿𝘀 and going beyond their expectations. The company is a proud 𝗲𝘅𝗰𝗹𝘂𝘀𝗶𝘃𝗲 𝘀𝗽𝗼𝗿𝘁𝘀 𝗱𝗮𝘁𝗮 𝗿𝗶𝗴𝗵𝘁𝘀 𝗵𝗼𝗹𝗱𝗲𝗿 𝗳𝗼𝗿 𝘀𝗲𝘃𝗲𝗿𝗮𝗹 𝗽𝗿𝗼𝗳𝗲𝘀𝘀𝗶𝗼𝗻𝗮𝗹 𝘀𝗽𝗼𝗿𝘁𝘀 𝗹𝗲𝗮𝗴𝘂𝗲𝘀 including prominent ones like 𝗙𝗼𝗿𝘁𝘂𝗻𝗮 𝗣𝗼𝗹𝗶𝘀𝗵 𝗖𝘂𝗽 (soccer), 𝗣𝗚𝗡𝗶𝗚 𝗦𝘂𝗽𝗲𝗿𝗹𝗶𝗴𝗮 (handball) and more. What STATSCORE offers: - 𝘀𝘂𝗽𝗲𝗿 𝗳𝗮𝘀𝘁 𝗿𝗲𝗮𝗹-𝘁𝗶𝗺𝗲 𝗱𝗮𝘁𝗮 𝗱𝗶𝗿𝗲𝗰𝘁𝗹𝘆 𝗳𝗿𝗼𝗺 𝘁𝗵𝗲 𝘃𝗲𝗻𝘂𝗲 - 𝘂𝗻𝗶𝗾𝘂𝗲 𝗶𝗻-𝗽𝗹𝗮𝘆 𝘃𝗶𝘀𝘂𝗮𝗹𝗶𝘇𝗮𝘁𝗶𝗼𝗻𝘀 - 𝗹𝗶𝘃𝗲 𝘀𝗰𝗼𝗿𝗲𝘀 & 𝗲𝘅𝘁𝗲𝗻𝗱𝗲𝗱 𝘀𝗽𝗼𝗿𝘁𝘀 𝘀𝘁𝗮𝘁𝘀 - 𝗽𝗹𝗮𝘆𝗲𝗿𝘀, 𝘁𝗲𝗮𝗺𝘀 𝗮𝗻𝗱 𝗰𝗼𝗺𝗽𝗲𝘁𝗶𝘁𝗶𝗼𝗻 𝘀𝘁𝗮𝘁𝘀, 𝗹𝗲𝗮𝗴𝘂𝗲 𝘀𝘁𝗮𝘁𝘀 - 𝗽𝗿𝗲𝗺𝗮𝘁𝗰𝗵 𝗵𝗶𝗻𝘁𝘀 𝘁𝗼 𝗲𝗻𝗴𝗮𝗴𝗲 𝗮𝗻𝗱 𝗶𝗻𝘀𝗽𝗶𝗿𝗲 𝗽𝗹𝗮𝘆𝗲𝗿𝘀 How can STATSCORE improve your online business: - 𝗶𝗻𝗰𝗿𝗲𝗮𝘀𝗲 𝘁𝘂𝗿𝗻𝗼𝘃𝗲𝗿 𝗳𝗼𝗿 𝗹𝗶𝘃𝗲 𝗮𝗻𝗱 𝗽𝗿𝗲-𝗺𝗮𝘁𝗰𝗵 𝗯𝗲𝘁𝘁𝗶𝗻𝗴 - 𝗶𝗻𝗰𝗿𝗲𝗮𝘀𝗲 𝘁𝗵𝗲 𝗻𝘂𝗺𝗯𝗲𝗿 𝗼𝗳 𝘃𝗶𝘀𝗶𝘁𝗼𝗿𝘀 𝘁𝗼 𝘆𝗼𝘂𝗿 𝘄𝗲𝗯𝘀𝗶𝘁𝗲 - 𝗶𝗻𝗰𝗿𝗲𝗮𝘀𝗲 𝘁𝗵𝗲 𝘁𝗶𝗺𝗲 𝘀𝗽𝗲𝗻𝘁 𝗯𝘆 𝘂𝘀𝗲𝗿𝘀 𝘃𝗶𝘀𝗶𝘁𝗶𝗻𝗴 𝘆𝗼𝘂𝗿 𝘄𝗲𝗯𝘀𝗶𝘁𝗲 - 𝗶𝗻𝗰𝗿𝗲𝗮𝘀𝗲 𝘁𝗵𝗲 𝗽𝗼𝗽𝘂𝗹𝗮𝗿𝗶𝘁𝘆 𝗼𝗳 𝘆𝗼𝘂𝗿 𝗯𝗲𝘁𝘁𝗶𝗻𝗴, 𝗺𝗲𝗱𝗶𝗮, 𝗼𝗿 𝘀𝗽𝗼𝗿𝘁𝘀 𝗯𝗿𝗮𝗻𝗱 - 𝗰𝗿𝗲𝗮𝘁𝗲 𝗮 𝗳𝗮𝗻 𝗲𝗻𝗴𝗮𝗴𝗲𝗺𝗲𝗻𝘁 𝗹𝗲𝘃𝗲𝗹 𝘁𝗵𝗮𝘁 𝗺𝗲𝗲𝘁𝘀 𝘆𝗼𝘂𝗿 𝗰𝗿𝗶𝘁𝗲𝗿𝗶𝗮

Statsforvaltningen er en statslig myndighed med hovedkontor i Aabenraa og otte afdelinger fordelt over hele landet. Vi er ca. 500 medarbejdere, der behandler ca. 180.000 sager om året inden for en lang række områder som for eksempel: forældremyndighed, bopæl, samvær, skilsmisse, adoption, EU-ophold, faderskab, indfødsret, værgemål og børne- og ægtefællebidrag. Statsforvaltningen hører organisatorisk og budgetmæssigt under Børne- og Socialministeriet, men arbejdsopgaverne løses for forskellige ministerier og styrelser. I Statsforvaltningen har vi fokus på borgertilfredshed og arbejder på alle områder for at sikre god kvalitet i sagsbehandlingen.

StatSim is a free probabilistic simulation web app. Multiple simulation methods and over 20 built-in distributions make it possible to create complex models and implement Bayesian inference in the browser.

Statskog SF - the Norwegian state-owned land and forest enterprise Statskog SF is a state-owned enterprise with a history back to 1860. Principal activities are forestry and land-use management on behalf of the Norwegian Government. Statskog SF is the landowner of about 20% of the Norwegian mainland surface. Head quarter in Namsos. 18 offices in Norway.